Electrodeposition of thin films by electrochemical - atomic layer deposition (ALD)
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The formation of metal nanofilms using Electrochemical ALD is discussed. Surface Limited Redox Reactions (SLRR) were used to form thin film deposits by ALD. The SLRR involves the underpotential deposition of an atomic layer of a less noble metal (sacrificial metal). This is then replaced in a solution of cations of the desired element, a more noble element. Lead was used as a sacrificial metal in the present studies. Cyclic Voltammetry was used to investigate the optimum deposition potential for Pb. An automated flow cell deposition system was employed to grow metal nano films. No Pb was present in the thin film was evident with electron probe microanalysis (EPMA). It was also shown that the Pb % in a deposit increased, as more negative Pb deposition potential were used. Deposits were characterized using X-ray diffraction (XRD), EPMA, scanning electron micrscopy (SEM), Atomic force microscopy and scanning tunneling microscopy (STM).